Invention Grant
- Patent Title: Semiconductor application installation adapted with a temperature equalization system
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Application No.: US13850704Application Date: 2013-03-26
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Publication No.: US09625141B2Publication Date: 2017-04-18
- Inventor: Tai-Her Yang
- Applicant: Tai-Her Yang
- Agency: Bacon & Thomas, PLLC
- Main IPC: F21V29/00
- IPC: F21V29/00 ; F21V29/56 ; F21V29/60 ; F24J3/08 ; G05D23/19 ; H05K7/20 ; F21V29/02 ; H01L31/024 ; H01L31/052 ; F24J2/24 ; H02S40/42 ; H02S40/38 ; H02S20/10 ; F21S9/03 ; F21W131/103 ; H01L23/473 ; F21Y101/00

Abstract:
The primary purpose of the present invention is to provide an fluid circulating installation adapted with a temperature equalization system and fluid transmission duct disposed in a heat carrier existing in solid or liquid state in the nature where presents comparatively larger and more reliable heat carrying capacity. The fluid passes through the solid or gas state semiconductor application installation to regulate the semiconductor application installation for temperature equalization, and flows back to the heat equalization installation disposed in the natural heat carrier of heat for the heat equalization installation providing good heat conduction in the natural heat carrier to provide the operation of temperature equalization regulating function on the backflow of the fluid.
Public/Granted literature
- US20130214142A1 SEMICONDUCTOR APPLICATION INSTALLATION ADAPTED WITH A TEMPERATURE EQUALIZATION SYSTEM Public/Granted day:2013-08-22
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