Invention Grant
- Patent Title: Valve package
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Application No.: US13829291Application Date: 2013-03-14
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Publication No.: US09625164B2Publication Date: 2017-04-18
- Inventor: Luis Leonardo Vargas , Justin E. Anderson , Wah Gwain Jeung
- Applicant: Air System Components, Inc.
- Applicant Address: US TX Plano
- Assignee: AIR SYSTEM COMPONENTS, INC.
- Current Assignee: AIR SYSTEM COMPONENTS, INC.
- Current Assignee Address: US TX Plano
- Agency: Jackson Walker LLP
- Agent Christopher J. Rouk
- Main IPC: F25B29/00
- IPC: F25B29/00 ; F24D19/00 ; F24F13/32 ; F24F1/00 ; F24F13/02 ; F24D3/10 ; F24D5/00

Abstract:
A heating, ventilating and air conditioning (HVAC) assembly that includes a duct and a coil assembly coupled to the duct. A supply line and return line are connected to the coil assembly. A first hanger assembly encircles the supply line, and a second hanger assembly encircles the return line. A support bracket has a first raised channel with a hole and second raised channel with a hole. A first threaded connector is secured using a square nut located in under the raised channel of the bracket, and a second threaded connector is connected to the threaded hole of the second hanger assembly and the second hole in a raised channel of a bracket and secured using a square nut located in under the raised channel of the bracket.
Public/Granted literature
- US20140262142A1 VALVE PACKAGE Public/Granted day:2014-09-18
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