Invention Grant
- Patent Title: Thermal flow meter with thin resin portion sealing temperature detection element
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Application No.: US14406596Application Date: 2013-05-29
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Publication No.: US09625296B2Publication Date: 2017-04-18
- Inventor: Noboru Tokuyasu , Shinobu Tashiro , Keiji Hanzawa , Tsutomu Kono
- Applicant: Hitachi Automotive Systems, Ltd.
- Applicant Address: JP Hitachinaka-shi
- Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee: Hitachi Automotive Systems, Ltd.
- Current Assignee Address: JP Hitachinaka-shi
- Agency: Crowell & Moring LLP
- Priority: JP2012-136394 20120615
- International Application: PCT/JP2013/064822 WO 20130529
- International Announcement: WO2013/187225 WO 20131219
- Main IPC: G01F1/684
- IPC: G01F1/684 ; G01F1/696 ; G01F15/14 ; F02D41/18 ; G01F1/698 ; G01F1/699 ; G01F5/00 ; G01F15/00 ; G01F15/02 ; G01F15/04 ; G01F15/18

Abstract:
To obtain a thermal flow meter capable of providing thermal insulation without degrading responsiveness of a temperature detection element. A thermal flow meter 300 of the present invention includes an air flow sensing portion 602 that detects a flow rate by performing heat transfer with a measurement target gas passing through the main passage 124 using a heat transfer surface, a temperature detection element 518 that detects a temperature of the measurement target gas, a circuit package 400 obtained by connecting a processing unit 604 that processes signals of the air flow sensing portion 602 and the temperature detection element 518 to a lead and sealing the processing unit 604 using a first molding resin through a first molding process, and a housing 302 where the circuit package 400 is fixed using a second molding resin through a second molding process, wherein, in the circuit package 400, a thickness of a temperature detecting portion 452 for sealing the temperature detection element 518 is thinner than that of a package body portion 426 for sealing the processing unit 604.
Public/Granted literature
- US20150135823A1 Thermal Flow Meter Public/Granted day:2015-05-21
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