Invention Grant
- Patent Title: Sensing sensor and sensing device
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Application No.: US14497349Application Date: 2014-09-26
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Publication No.: US09625420B2Publication Date: 2017-04-18
- Inventor: Hiroyuki Kukita
- Applicant: NIHON DEMPA KOGYO CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: NIHON DEMPA KOGYO CO., LTD.
- Current Assignee: NIHON DEMPA KOGYO CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Jianq Chyun IP Office
- Priority: JP2013-204120 20130930
- Main IPC: G01N29/036
- IPC: G01N29/036 ; G01N29/02 ; G01N29/22

Abstract:
A sensing sensor includes a wiring board, a piezoelectric resonator, a channel forming member, a channel, an effluent channel, a capillary member, and an absorbing member. The effluent channel is disposed at a downstream side of the channel. The effluent channel is configured to discharge the sample solution inside of the channel by capillarity. The capillary member is disposed at a downstream side of the effluent channel in contact with the sample solution flowing through an inside of the effluent channel. The capillary member is configured to cause the sample solution to flow through by the capillarity. The absorbing member is disposed at a downstream side of the capillary member. The absorbing member is configured to absorb the sample solution flowing through the capillary member.
Public/Granted literature
- US20150090035A1 SENSING SENSOR AND SENSING DEVICE Public/Granted day:2015-04-02
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