Invention Grant
- Patent Title: Adaptor structure and apparatus for testing a semiconductor package including the same
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Application No.: US14725512Application Date: 2015-05-29
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Publication No.: US09625522B2Publication Date: 2017-04-18
- Inventor: Hyun-Guen Iy , Bo-Seong Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP
- Priority: KR10-2014-0149689 20141031
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R31/28 ; G01R31/26 ; G01R1/04 ; G01R1/073

Abstract:
An adaptor structure includes a main adaptor, a first sub-adaptor, a second sub-adaptor and a first driving mechanism. The main adaptor is over a socket. The main adaptor has an opening. The first sub-adaptor is movably received in the opening of the main adaptor in a first direction. The first sub-adaptor is configured to support a first side surface of the semiconductor package. The second sub-adaptor is movably received in the opening of the main adaptor in the first direction and a second direction. The second sub-adaptor faces the first sub-adaptor to support a second side surface of the semiconductor package. The first driving mechanism is configured to move the second sub-adaptor in the second direction. Thus, the adaptor structure can guide the semiconductor packages having different sizes to the socket.
Public/Granted literature
- US20160124042A1 ADAPTOR STRUCTURE AND APPARATUS FOR TESTING A SEMICONDUCTOR PACKAGE INCLUDING THE SAME Public/Granted day:2016-05-05
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