Invention Grant
- Patent Title: Optoelectronic integrated circuit
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Application No.: US14222841Application Date: 2014-03-24
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Publication No.: US09625647B2Publication Date: 2017-04-18
- Inventor: Geoff W. Taylor
- Applicant: Opel Solar, Inc. , The University of Connecticut
- Applicant Address: US CT Farmington US CT Storrs Mansfield
- Assignee: THE UNIVERSITY OF CONNECTICUT,Opel Solar, Inc.
- Current Assignee: THE UNIVERSITY OF CONNECTICUT,Opel Solar, Inc.
- Current Assignee Address: US CT Farmington US CT Storrs Mansfield
- Agency: Sughrue Mion, PLLC
- Main IPC: H01L29/10
- IPC: H01L29/10 ; G02B6/134 ; H01L27/144 ; H01L31/0352 ; H01S5/042 ; H01L29/66 ; H01L29/74 ; H01L21/8252 ; H01L29/778 ; H01L27/06 ; H01L27/085 ; H01L31/111 ; H01L33/10 ; H01S5/0625 ; H01S5/343 ; H01S5/062 ; H01S5/10 ; H01S5/20 ; H01S5/30 ; H01S5/22

Abstract:
A semiconductor device employs an epitaxial layer arrangement including a first ohmic contact layer and first modulation doped quantum well structure disposed above the first ohmic contact layer. The first ohmic contact layer has a first doping type, and the first modulation doped quantum well structure has a modulation doped layer of a second doping type. At least one isolation ion implant region is provided that extends through the first ohmic contact layer. The at least one isolation ion implant region can include oxygen ions. The at least one isolation ion implant region can define a region that is substantially free of charge carriers in order to reduce a characteristic capacitance of the device. A variety of high performance transistor devices (e.g., HFET and BICFETs) and optoelectronic devices can employ this device structure. Other aspects of wavelength-tunable microresonantors and related semiconductor fabrication methodologies are also described and claimed.
Public/Granted literature
- US20150214425A1 Optoelectronic Integrated Circuit Public/Granted day:2015-07-30
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