Provided are a photosensitive resin composition which is excellent in a moisture and heat resistance and provides a cured product thereof with a high elastic modulus at high temperature and which is excellent as well in a hollow structure holding property and a photosensitive film prepared by using the same, a forming method for a rib pattern, a hollow structure and a forming method for the same and an electronic component. In an electronic component having a hollow structure, a photosensitive resin composition is used as a rib material or a cover material for forming the hollow structure described above, and it is characterized by using a photosensitive resin composition containing (A) a photopolymerizable compound having at least one ethylenically unsaturated group and (B) a photopolymerization initiator and a photosensitive film obtained from the above photosensitive resin composition. Used as the component (A) are acrylate compounds or methacrylate compounds, to be specific, an acrylate compound or a methacrylate compound having an amide group and an acrylate compound or a methacrylate compound containing a urethane bond.