Invention Grant
- Patent Title: Mechanisms for performing a photolithography process with a surface modifying treatment on an exposed photoresist layer
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Application No.: US14067167Application Date: 2013-10-30
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Publication No.: US09625822B2Publication Date: 2017-04-18
- Inventor: Chi-Cheng Tsai , Hung-Chi Wu , Tsung-Chuan Lee , Chung-Hsien Lin
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: G03F7/38
- IPC: G03F7/38 ; G03F7/20

Abstract:
Embodiments of performing a photolithography process are provided. The method for performing the photolithography process includes providing a substrate and forming a photoresist layer over the substrate. The method further includes forming exposed photoresist portions by performing an exposure process on the photoresist layer. The method further includes performing a surface modifying treatment on the photoresist layer after the exposure process and removing the exposed photoresist portions by performing a developing process.
Public/Granted literature
- US20150116679A1 MECHANISMS FOR PERFORMING A PHOTOLITHOGRAPHY PROCESS Public/Granted day:2015-04-30
Information query
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