Invention Grant
- Patent Title: Composite cover assembly for electronic devices
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Application No.: US14223414Application Date: 2014-03-24
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Publication No.: US09626024B1Publication Date: 2017-04-18
- Inventor: Hung-Bing Tan , David Eric Peters , Shan Cheng , Shankar Ganapathysubramanian
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US WA Seattle
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US WA Seattle
- Agency: Lee & Hayes, PLLC
- Main IPC: G02F1/1335
- IPC: G02F1/1335 ; G06F3/041 ; H05K13/00

Abstract:
Describe herein are electronic devices that includes a display stack having a composite cover component atop a display component. In some instances, the composite cover component includes a top layer and a bottom layer formed from an inorganic material and at least one inner layer formed from an organic material. In other instances, the composite cover component includes a top layer and a bottom layer formed from an organic material and at least one inner layer formed from an inorganic material.
Information query
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