Invention Grant
- Patent Title: Method and apparatus for localized and controlled removal of material from a substrate
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Application No.: US14208124Application Date: 2014-03-13
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Publication No.: US09627234B2Publication Date: 2017-04-18
- Inventor: Hui-Min Huang , Chih-Wei Lin , Cheng-Ting Chen , Ming-Da Cheng , Chung-Shi Liu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02 ; G03F7/42
Abstract:
A method and a system that include providing a localized dispensing apparatus. A substrate having a material disposed on its top surface is oriented above the localized dispensing apparatus. A chemical is then dispensed from the localized dispensing apparatus onto the top surface of the oriented substrate. The chemical removes the material. The path for the material removal may be determined and the localized dispensing apparatus programmed to provide chemical according to the path.
Public/Granted literature
- US20140273499A1 Method and Apparatus for Localized and Controlled Removal of Material from a Substrate Public/Granted day:2014-09-18
Information query
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