Invention Grant
- Patent Title: Semiconductor package with cantilever leads
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Application No.: US13442998Application Date: 2012-04-10
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Publication No.: US09627296B2Publication Date: 2017-04-18
- Inventor: Jeffrey Gail Holloway
- Applicant: Jeffrey Gail Holloway
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Jacqueline J. Gamer; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/56 ; H01L23/31 ; H01L23/00
Abstract:
A semiconductor package includes a metallic leadframe having a plurality of cantilever leads, a mounting area for mounting a die, and one or more non-conductive supports adjacent to a recessed surface of the cantilever leads to support the leads during die mount, wire bond, and encapsulation processes. Encapsulant encapsulates and supports at least a portion of the die, the leadframe.
Public/Granted literature
- US20120199962A1 Semiconductor Package with Cantilever Leads Public/Granted day:2012-08-09
Information query
IPC分类:
