Invention Grant
- Patent Title: Semiconductor device having reduced contact resistance
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Application No.: US14828639Application Date: 2015-08-18
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Publication No.: US09627322B2Publication Date: 2017-04-18
- Inventor: Injo Ok , Balasubramanian S. Pranatharthiharan , Charan V. Surisetty
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Steven Meyers
- Main IPC: H01L23/535
- IPC: H01L23/535 ; H01L21/768 ; H01L21/3105 ; H01L23/485 ; H01L23/532 ; H01L27/02 ; H01L27/088

Abstract:
A semiconductor device including at least one self-aligned contact has at least one gate electrode on a bulk substrate layer of the semiconductor device. A gate cap encapsulates the at least one gate electrode. The semiconductor device further includes at least one contact separated from the at least one gate electrode via a portion of the gate cap. The at least one contact includes a metal portion that directly contacts the gate cap.
Public/Granted literature
- US20160148872A1 SEMICONDUCTOR DEVICE HAVING REDUCED CONTACT RESISTANCE Public/Granted day:2016-05-26
Information query
IPC分类: