Invention Grant
- Patent Title: Semiconductor package and method of manufacturing the same
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Application No.: US14815937Application Date: 2015-07-31
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Publication No.: US09627327B2Publication Date: 2017-04-18
- Inventor: Baik-woo Lee , Dong-hun Lee , Jae-gwon Jang , Chul-yong Jang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR
- Agency: Renaissance IP Law Group LLP
- Priority: KR10-2014-0134473 20141006
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/552 ; H01L21/56 ; H01L21/78 ; H01L23/00 ; B29C70/78 ; B29K63/00 ; B29L9/00 ; B29L31/34 ; H01L25/065 ; H01L25/18
Abstract:
Provided is a method of manufacturing a semiconductor package. The method includes mounting a semiconductor device on a substrate; disposing a mold on the substrate, wherein the mold is formed to cover the semiconductor device such that at least one inner side surface of the mold has a slope; providing a molding material into the mold to encapsulate the semiconductor device; removing the mold from the substrate; and forming an electromagnetic shielding (EMS) layer to cover a top surface and side surfaces of the molding material.
Public/Granted literature
- US20160099218A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-04-07
Information query
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