Invention Grant
- Patent Title: Capacitor structure and method of manufacturing the same
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Application No.: US14826210Application Date: 2015-08-14
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Publication No.: US09627468B2Publication Date: 2017-04-18
- Inventor: Shyng-Yeuan Che , Hsin-Lan Hsueh
- Applicant: Powerchip Technology Corporation
- Applicant Address: TW Hsinchu
- Assignee: Powerchip Technology Corporation
- Current Assignee: Powerchip Technology Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW104117462A 20150529
- Main IPC: H01L21/321
- IPC: H01L21/321 ; H01L49/02 ; H01L21/768 ; H01L21/285 ; H01L21/3213 ; H01L21/311 ; H01L23/522

Abstract:
Provided is a capacitor structure including a substrate, a dielectric layer, a first conductive layer, and a cup-shaped capacitor. The dielectric layer is located on the substrate. The first conductive layer is located in the dielectric layer. The cup-shaped capacitor penetrates through the first conductive layer and is located in the dielectric layer. The cup-shaped capacitor includes a bottom electrode, a capacitor dielectric layer, and a top electrode. Two sidewalls of the bottom electrode are electrically connected to the first conductive layer. The capacitor dielectric layer covers a surface of the bottom electrode. The top electrode covers a surface of the capacitor dielectric layer. The capacitor dielectric layer is located between the top electrode and the bottom electrode. A top surface of the bottom electrode is lower than a top surface of the top electrode. Also the invention provides a method of manufacturing the capacitor structure.
Public/Granted literature
- US20160351656A1 CAPACITOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-12-01
Information query
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