Invention Grant
- Patent Title: High voltage metal oxide semiconductor device and method for making same
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Application No.: US12715501Application Date: 2010-03-02
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Publication No.: US09627524B2Publication Date: 2017-04-18
- Inventor: Tsung-Yi Huang , Huan-Ping Chu , Ching-Yao Yang , Hung-Der Su
- Applicant: Tsung-Yi Huang , Huan-Ping Chu , Ching-Yao Yang , Hung-Der Su
- Applicant Address: TW Chupei, Hsinchu
- Assignee: RICHTEK TECHNOLOGY CORPORATION, R.O.C.
- Current Assignee: RICHTEK TECHNOLOGY CORPORATION, R.O.C.
- Current Assignee Address: TW Chupei, Hsinchu
- Agency: Tung & Associates
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78

Abstract:
The present invention discloses a high voltage metal oxide semiconductor (HVMOS) device and a method for making same. The high voltage metal oxide semiconductor device comprises: a substrate; a gate structure on the substrate; a well in the substrate, the well defining a device region from top view; a first drift region in the well; a source in the well; a drain in the first drift region, the drain being separated from the gate structure by a part of the first drift region; and a P-type dopant region not covering all the device region, wherein the P-type dopant region is formed by implanting a P-type dopant for enhancing the breakdown voltage of the HVMOS device (for N-type HVMOS device) or reducing the ON resistance of the HVMOS device (for P-type HVMOS device).
Public/Granted literature
- US20110215403A1 High Voltage Metal Oxide Semiconductor Device and Method for Making Same Public/Granted day:2011-09-08
Information query
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