As a wireless module which is capable of improving heat dissipation while suppressing degradation of antenna characteristics, there is provided a wireless module including: a first substrate having a first surface on which a plurality of antennas and a ground portion are disposed; and a heat dissipating member disposed opposite the first surface of the first substrate. The heat dissipating member includes a plurality of openings corresponding to the plurality of antennas respectively and an intervening portion which intervenes between the plurality of openings. The ground portion is disposed between the first substrate and the heat dissipating member.