Invention Grant
- Patent Title: Printed circuit board and method of manufacturing the same
-
Application No.: US14169097Application Date: 2014-01-30
-
Publication No.: US09629260B2Publication Date: 2017-04-18
- Inventor: Seung Wook Park , Young Do Kweon , Jin Gu Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2013-0058533 20130523
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/42 ; H05K3/10 ; H05K1/03 ; H05K3/28
Abstract:
Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board according to a preferred embodiment of the present invention includes a base substrate; a through via formed to penetrate through the base substrate; and circuit patterns formed on one side and the other side of the base substrate and formed to be thinner than an inner wall of the through via.
Public/Granted literature
- US20140345916A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-11-27
Information query
