Invention Grant
- Patent Title: Multiple liquid loop cooling for electronics
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Application No.: US12823097Application Date: 2010-06-24
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Publication No.: US09629280B2Publication Date: 2017-04-18
- Inventor: Scott T. Johnson
- Applicant: Scott T. Johnson
- Applicant Address: US MA Waltham
- Assignee: RAYTHEON COMPANY
- Current Assignee: RAYTHEON COMPANY
- Current Assignee Address: US MA Waltham
- Agency: Lewis Roca Rothgerber Christie LLP
- Main IPC: F28D15/00
- IPC: F28D15/00 ; F28F7/00 ; H05K7/20

Abstract:
The present invention relates to liquid cooling systems and more particularly to a liquid cooling system for an electrical system on an air-cooled platform. In one embodiment of the invention, a liquid-cooled system for a platform with air cooling includes an electrical system comprising first and second electrical components; a cooling unit comprising an air flow path, a first heat exchanger in the air flow path, and a second heat exchanger in the air flow path downstream of the first heat exchanger; a first liquid loop passing through the first heat exchanger and the first electrical component; and a second liquid loop passing through the second heat exchanger and the second electrical component. The first liquid loop is substantially thermally isolated from the second liquid loop.
Public/Granted literature
- US20110315354A1 MULTIPLE LIQUID LOOP COOLING FOR ELECTRONICS Public/Granted day:2011-12-29
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