Invention Grant
- Patent Title: Substrate for printed electronics and photonic curing process
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Application No.: US14405662Application Date: 2013-05-31
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Publication No.: US09631283B2Publication Date: 2017-04-25
- Inventor: Kurt A. Schroder , Hiroshi Uchida , Kenji Shinozaki
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo US TX Austin
- Assignee: SHOWA DENKO K.K.,NCC NANO, LLD
- Current Assignee: SHOWA DENKO K.K.,NCC NANO, LLD
- Current Assignee Address: JP Tokyo US TX Austin
- Agency: Sughrue Mion, PLLC
- International Application: PCT/IB2013/001254 WO 20130531
- International Announcement: WO2013/182896 WO 20131212
- Main IPC: B32B3/02
- IPC: B32B3/02 ; C23C30/00 ; B41M3/00 ; H05K1/03 ; H05K3/12 ; H05K1/09
Abstract:
A coating layer 12 is formed on a base film 10 by heat resistant resin having a Tg (glass transition temperature) of 120° C. or more, and more preferably 200° C. or more, and a functional thin film 14 is produced by printing ink composite including conductive particles on a surface of the coating layer 12 and thereby forming an ink layer. This functional thin film 14 is sintered by heating performed by photo irradiation, and a conductive layer is formed thereby.
Public/Granted literature
- US20150225857A1 SUBSTRATE FOR PRINTED ELECTRONICS AND PHOTONIC CURING PROCESS Public/Granted day:2015-08-13
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