Invention Grant
- Patent Title: Methods and apparatus for cleaning semiconductor wafers
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Application No.: US15282298Application Date: 2016-09-30
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Publication No.: US09633833B2Publication Date: 2017-04-25
- Inventor: Jian Wang , Sunny Voha Nuch , Liangzhi Xie , Junping Wu , Zhaowei Jia , Yunwen Huang , Zhifeng Gao , Yue Ma , Hui Wang
- Applicant: ACM Research (Shanghai) Inc.
- Applicant Address: CN
- Assignee: ACM RESEARCH (SHANGHAI) INC.
- Current Assignee: ACM RESEARCH (SHANGHAI) INC.
- Current Assignee Address: CN
- Agency: Miskin & Tsui-Yip LLP
- Agent Gloria Tsui-Yip, Esq.
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/67 ; B08B3/12
Abstract:
A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process by turn the semiconductor substrate or the ultra/mega sonic device clockwise or counter clockwise.
Public/Granted literature
- US20170032959A1 Methods and Apparatus for Cleaning Semiconductor Wafers Public/Granted day:2017-02-02
Information query
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