A lead frame includes a die pad and a plurality of leads arranged around the die pad. Each of the leads includes an inner lead, a bent portion, and an external connection terminal. The inner lead includes a distal portion, adjacent to the die pad, and a connection end portion, located at an opposite end of the inner lead from the distal portion. The bent portion is connected to the connection end portion of the inner lead. The external connection terminal is connected by the bent portion to the connection end portion of the inner lead and located below the inner lead. The external connection terminal includes an upper surface that faces to and is parallel to a lower surface of the inner lead. The inner lead, the bent portion, and the external connection terminal are formed integrally in each of the leads.