Invention Grant
- Patent Title: Semiconductor package and manufacturing method thereof
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Application No.: US15049872Application Date: 2016-02-22
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Publication No.: US09633939B2Publication Date: 2017-04-25
- Inventor: Do Hyung Kim , Dae Joon Park , See Won Kim , Jung Soo Park
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee: AMKOR TECHNOLOGY, INC.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Priority: KR10-2015-0024957 20150223
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/498 ; H01L23/31 ; H01L21/56
Abstract:
A semiconductor package and a method of manufacturing a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor packages, and methods of making thereof, that comprise a cover layer that enhances reliability of the semiconductor packages.
Public/Granted literature
- US20160247767A1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-08-25
Information query
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