- Patent Title: System and methods for converting planar design to FinFET design
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Application No.: US14444801Application Date: 2014-07-28
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Publication No.: US09634001B2Publication Date: 2017-04-25
- Inventor: Clement Hsingjen Wann , Chih-Sheng Chang , Yi-Tang Lin , Ming-Feng Shieh , Ting-Chu Ko , Chung-Hsien Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/417 ; H01L29/66 ; H01L29/78 ; G06F17/50 ; H01L27/02 ; G03F1/00 ; H01L23/48 ; H01L21/8238 ; H01L21/84

Abstract:
A FinFET structure layout includes a semiconductor substrate comprising a plurality of FinFET active areas, and a plurality of fins within each FinFET active area of the plurality of FinFET active areas. The FinFET structure layout further includes a gate having a gate length parallel to the semiconductor substrate and perpendicular to length of the plurality of fins within each FinFET active area of the plurality of FinFET active areas. The FinFET structure layout further includes a plurality of metal features connecting a source region or a drain region of a portion of the plurality of FinFET active areas to a plurality of contacts. The plurality of metal features includes a plurality of metal lines parallel to a FinFET channel direction and a plurality of metal lines parallel to a FinFET channel width direction.
Public/Granted literature
- US20140332904A1 SYSTEM AND METHODS FOR CONVERTING PLANAR DESIGN TO FINFET DESIGN Public/Granted day:2014-11-13
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