Invention Grant
- Patent Title: Semiconductor device
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Application No.: US14798890Application Date: 2015-07-14
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Publication No.: US09634130B2Publication Date: 2017-04-25
- Inventor: Yuichi Onozawa
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki-Shi
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi
- Agency: Rossi, Kimms & McDowell LLP
- Priority: JP2010-051636 20100309
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L29/10 ; H01L29/423 ; H01L29/417 ; H01L29/06 ; H01L29/08 ; H01L29/40

Abstract:
A semiconductor device includes stripe-shaped gate trench formed in one major surface of n-type drift layer, gate trench including gate polysilicon formed therein, and gate polysilicon being connected to a gate electrode; p-type base layer formed selectively in mesa region between adjacent gate trenches, p-type base layer including n-type emitter layer and connected to emitter electrode; one or more dummy trenches formed between p-type base layers adjoining to each other in the extending direction of gate trenches; and electrically conductive dummy polysilicon formed on an inner side wall of dummy trench with gate oxide film interposed between dummy polysilicon and dummy trench, dummy polysilicon being spaced apart from gate polysilicon. Dummy polysilicon may be connected to emitter electrode. The structure according to the invention facilitates providing an insulated-gate semiconductor device, the Miller capacitance of which is small, even when the voltage applied between the collector and emitter is low.
Public/Granted literature
- US20150318386A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-11-05
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