Invention Grant
- Patent Title: Systems and methods for thermally managing high-temperature processes on temperature sensitive substrates
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Application No.: US14150376Application Date: 2014-01-08
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Publication No.: US09634175B2Publication Date: 2017-04-25
- Inventor: Lawrence M. Woods , Rosine Ribelin , Joseph H. Armstrong
- Applicant: Ascent Solar Technologies, Inc.
- Applicant Address: US CO Thornton
- Assignee: ASCENT SOLAR TECHNOLOGIES, INC.
- Current Assignee: ASCENT SOLAR TECHNOLOGIES, INC.
- Current Assignee Address: US CO Thornton
- Agency: Lathrop & Gage LLP
- Main IPC: H01L31/18
- IPC: H01L31/18 ; H01L31/032 ; H01L31/0392 ; H01L21/67 ; C23C14/00 ; C23C14/20 ; C23C14/54 ; H01L21/02
Abstract:
A method for depositing one or more thin-film layers on a flexible polyimide substrate having opposing front and back outer surfaces includes the following steps: (a) heating the flexible polyimide substrate such that a temperature of the front outer surface of the flexible polyimide substrate is higher than a temperature of the back outer surface of the flexible polyimide substrate, and (b) depositing the one or more thin-film layers on the front outer surface of the flexible polyimide substrate. A deposition zone for executing the method includes (a) one of more physical vapor deposition sources adapted to deposit one or more metallic materials on the front outer surface of the substrate, and (b) one or more radiant zone boundary heaters.
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