- Patent Title: High-density, fail-in-place switches for computer and data networks
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Application No.: US14548345Application Date: 2014-11-20
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Publication No.: US09634959B2Publication Date: 2017-04-25
- Inventor: Paul W. Coteus , Fuad E. Doany , Shawn A. Hall , Mark D. Schultz , Todd E. Takken , Shurong Tian
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent L. Jeffrey Kelly
- Main IPC: H05K7/18
- IPC: H05K7/18 ; H04L12/933 ; H05K7/20

Abstract:
A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.
Public/Granted literature
- US20150289406A1 HIGH-DENSITY, FAIL-IN-PLACE SWITCHES FOR COMPUTER AND DATA NETWORKS Public/Granted day:2015-10-08
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