Invention Grant
- Patent Title: Compression molded articles employing circumferential surfaces having friction-enhancing patterns to contact substrates during wet chemical processes
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Application No.: US14616704Application Date: 2015-02-07
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Publication No.: US09636714B2Publication Date: 2017-05-02
- Inventor: David P. Alvarez , Jim K. Atkinson
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: B08B1/00
- IPC: B08B1/00 ; B08B1/04 ; B08B13/00 ; B29C43/02 ; H01L21/67 ; B29K27/12 ; B29K75/00 ; B29L31/00

Abstract:
Compression molded articles employing circumferential surfaces having friction-enhancing patterns to contact substrates during wet chemical processes are disclosed. An article such as an annular body may be formed by a compression molding technique. By including a patterned surface as part of an outer circumferential surface of the annular body, frictional contact between the annular body and the substrate may be enhanced as friction-reducing fluids associated with a wet chemical processes may be directed away from the desired friction contact area between the annular body and the substrate. In this manner, frictional contact may be enhanced and the substrate may be effectively positioned and moved during the wet chemical process to improve the effectively of the process.
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Information query
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