Invention Grant
- Patent Title: Cutting apparatus
-
Application No.: US14333016Application Date: 2014-07-16
-
Publication No.: US09636844B2Publication Date: 2017-05-02
- Inventor: Nobuhiko Wakita
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain Ltd.
- Priority: JP2013-149698 20130718
- Main IPC: B26D7/26
- IPC: B26D7/26 ; B28D5/02 ; B23B31/30 ; B28D5/00 ; B24B45/00 ; B27B5/30 ; B27B5/32 ; B24B27/06

Abstract:
A cutting unit includes a spindle, a spindle housing, a support flange on the front of the spindle, a cutting blade detachably supported to the support flange, and a fixing flange for fixing the cutting blade to the support flange. The support flange includes a boss portion adapted to be inserted through a central opening of the cutting blade, a flange portion for supporting one side surface of the cutting blade, and a cylindrical portion for engaging the front of the spindle. The flange portion has a suction hole opening toward the fixing flange, and the cylindrical portion has a communication hole communicating with the suction hole. The communication hole is connected to a vacuum source through a rotary joint fixed to the spindle housing so that communication between the communication hole and the vacuum source is selectively made by an on-off valve.
Public/Granted literature
- US20150020666A1 CUTTING APPARATUS Public/Granted day:2015-01-22
Information query