An imprint apparatus of the present invention that molds and cures an imprint material on a substrate using a mold to form a pattern on the substrate. The imprint apparatus includes a supply unit configured to supply a gas into a gap between the imprint material on the substrate and the mold. The supply unit is configured to supply a mixed gas in which a permeable gas, which permeates at least one of the mold, the imprint material and the substrate, and a condensable gas, which is liquefied under a pressure generated by the molding, is mixed with each other.