A method for checking the security of installation of a joining element to be fixed to a component via an adhesive connection, wherein the adhesive is taken from an adhesive receptacle and is curable by exposure to light from a light emitter. The fill level of the adhesive receptacle is monitored and, upon reaching a lower threshold value of the determined level of the adhesive receptacle, a fluid connection device of a second adhesive receptacle having an adhesive fill level which is higher than that of the adhesive receptacle, is actuated to produce a fluid connection having an adhesive output device. The intensity of the light emitted from the light emitter is inspected by at least one sensor and a signal is output upon falling short of a threshold value of the light received by the sensor.