Invention Grant
- Patent Title: Embossing die creation
-
Application No.: US14353652Application Date: 2011-10-27
-
Publication No.: US09636941B2Publication Date: 2017-05-02
- Inventor: Eyal Peleg , Shahar Stein
- Applicant: Eyal Peleg , Shahar Stein
- Applicant Address: NL Amstelveen
- Assignee: Hewlett-Packard Indigo B.V.
- Current Assignee: Hewlett-Packard Indigo B.V.
- Current Assignee Address: NL Amstelveen
- Agency: HP Inc. Patent Department
- International Application: PCT/EP2011/068913 WO 20111027
- International Announcement: WO2013/060375 WO 20130502
- Main IPC: B41C1/00
- IPC: B41C1/00 ; B29C67/00 ; B44B5/02 ; G03G15/22

Abstract:
An embossing die is created by printing multiple ink layers (530, 540) in superposition thereby to build up a printed relief pattern (510) in accordance with received design data specifying a design to be embossed. The design data is modified after receipt to introduce into the printed relief pattern to be built, one or more channels (610) which extend depth-wise through multiple ink layers of the printed relief pattern (510) and serve to fully or partially segment the printed relief pattern.
Public/Granted literature
- US20140283699A1 Embossing Die Creation Public/Granted day:2014-09-25
Information query