Invention Grant
- Patent Title: Film-wrapped bundle opener
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Application No.: US13275952Application Date: 2011-10-18
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Publication No.: US09637263B2Publication Date: 2017-05-02
- Inventor: Homer L. Dickerson , James M. Pippin , Lelan D. Warren
- Applicant: Homer L. Dickerson , James M. Pippin , Lelan D. Warren
- Applicant Address: US GA Alpharetta
- Assignee: SIEMENS INDUSTRY, INC.
- Current Assignee: SIEMENS INDUSTRY, INC.
- Current Assignee Address: US GA Alpharetta
- Main IPC: B65B69/00
- IPC: B65B69/00 ; B65B61/18 ; B26F3/00 ; B26F3/06

Abstract:
Methods and tools for opening polyfilm-wrapped packages. A tool includes a rubbing surface and a motor configured to move the rubbing surface. The tool includes a power source connected to supply power to the rubbing surface. The rubbing surface is applied to the polyfilm wrapping while being moved to create an opening in the polyfilm wrapping caused at least in part by friction heat. The opening is created without damaging contents of the package.
Public/Granted literature
- US20120096817A1 Film-Wrapped Bundle Opener Public/Granted day:2012-04-26
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