Invention Grant
- Patent Title: Membrane transducer structures and methods of manufacturing same using thin-film encapsulation
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Application No.: US14532675Application Date: 2014-11-04
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Publication No.: US09637371B2Publication Date: 2017-05-02
- Inventor: Emmanuel P Quevy , Jeremy R. Hui , Carrie Wing-Zin Low
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
- Applicant Address: CN Shanghai
- Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
- Current Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
- Current Assignee Address: CN Shanghai
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: B81B3/00
- IPC: B81B3/00 ; B81B7/00 ; B81C1/00 ; G01N27/22
Abstract:
Membrane transducer structures and thin-film encapsulation methods for manufacturing the same are provided. In one example, the thin film encapsulation methods may be implemented to co-integrate processes for thin-film encapsulation and formation of microelectronic devices and microelectromechanical systems (MEMS) that include the membrane transducers.
Public/Granted literature
- US20160023889A1 Membrane Transducer Structures And Methods Of Manufacturing Same Using Thin-Film Encapsulation Public/Granted day:2016-01-28
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