Invention Grant
- Patent Title: Resin composition and moulded article using same
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Application No.: US14769267Application Date: 2013-09-02
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Publication No.: US09637630B2Publication Date: 2017-05-02
- Inventor: Seon-Ae Lee , Young-Sin Kim , Min-Young Lim , Kang-Yeol Park
- Applicant: Cheil Industries Inc.
- Applicant Address: KR Yongin-si
- Assignee: Samsung SDI Co., Ltd.
- Current Assignee: Samsung SDI Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: Additon, Higgins & Pendleton, P.A.
- Priority: KR10-2013-0018734 20130221
- International Application: PCT/KR2013/007904 WO 20130902
- International Announcement: WO2014/129712 WO 20140828
- Main IPC: C08L55/02
- IPC: C08L55/02 ; C08K3/08 ; C08K9/00 ; C08J7/04 ; C08L101/00 ; C08K9/02
Abstract:
A resin composition includes (A) a thermoplastic resin, (B) a first metal layer-resin composite particle including a first metal layer and first thermosetting resin coating layers positioned on the first metal layer and (C) a second metal layer-resin composite particle including a second metal layer and second thermosetting resin coating layers positioned on the second metal layer, and a molded article using the same.
Public/Granted literature
- US20150376396A1 Resin Composition and Moulded Article Using Same Public/Granted day:2015-12-31
Information query
