An apparatus and method for cooling a dual, walled component is disclosed herein. An augmented cooling system according to the present disclosure includes transporting a cooling fluid through one wall of a cooling pathway formed between two opposing spaced apart walls of the dual walled component. The cooling fluid can be deflected away from one wall of the cooling pathway with a first trip strip as the cooling fluid traverses along the cooling pathway. The cooling fluid can be deflected away from the opposing wall of the cooling pathway with a second trip strip as the cooling fluid continues traversing along the cooling pathway. The cooling fluid can then be discharged from the cooling pathway through the opposing wall of the dual walled component.