Invention Grant
- Patent Title: Valve apparatus
-
Application No.: US14337394Application Date: 2014-07-22
-
Publication No.: US09638345B2Publication Date: 2017-05-02
- Inventor: Yuzuru Okita , Tetsuro Maruyama
- Applicant: SMC Corporation
- Applicant Address: JP Chiyoda-ku
- Assignee: SMC CORPORATION
- Current Assignee: SMC CORPORATION
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-233348 20131111
- Main IPC: F16K31/122
- IPC: F16K31/122 ; F16K7/14

Abstract:
A valve apparatus is equipped with a diaphragm disposed displaceably in the interior of a body, and which opens and closes a fluid passage by separating away from and being seated on a valve seat, a conductive shaft arranged in a through hole that is formed substantially in the center of the diaphragm, and a grounding member for grounding the conductive shaft. Each of the body and the diaphragm is formed from a non-conductive material, and one end surface of the conductive shaft is exposed to the fluid passage.
Public/Granted literature
- US20150129791A1 VALVE APPARATUS Public/Granted day:2015-05-14
Information query