Invention Grant
- Patent Title: Chip level sensor with multiple degrees of freedom
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Application No.: US13690932Application Date: 2012-11-30
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Publication No.: US09638524B2Publication Date: 2017-05-02
- Inventor: Ando Feyh , Po-Jui Chen
- Applicant: Ando Feyh , Po-Jui Chen
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Maginot Moore & Beck LLP
- Main IPC: G01C19/5712
- IPC: G01C19/5712 ; B81B7/02 ; G01P15/12 ; G01C19/5755 ; G01C19/5769 ; G01P15/125 ; G01C25/00 ; G01P15/08 ; G01P15/18
Abstract:
A sensing assembly device includes a substrate, a chamber above the substrate, a first piezoelectric gyroscope sensor positioned within the chamber, and a first accelerometer positioned within the chamber.
Public/Granted literature
- US20140150552A1 Chip Level Sensor with Multiple Degrees of Freedom Public/Granted day:2014-06-05
Information query
