Invention Grant
- Patent Title: Cavity-down pressure sensor device
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Application No.: US14248324Application Date: 2014-04-08
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Publication No.: US09638596B2Publication Date: 2017-05-02
- Inventor: Wai Yew Lo
- Applicant: Wai Yew Lo
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee: FREESCALE SEMICONDUCTOR, INC.
- Current Assignee Address: US TX Austin
- Agent Charles E. Bergere
- Main IPC: G01L9/00
- IPC: G01L9/00 ; H01L23/495 ; H01L25/04 ; G01L19/00 ; G01L19/06
Abstract:
A cavity-down pressure sensor device has a pressure-sensing die that is electrically connected to a master control unit (MCU) using face-to-face bonding. Connecting the pressure-sensing die in this manner avoids the need to wire bond the pressure-sensing die to the master control unit.
Public/Granted literature
- US20150285702A1 CAVITY-DOWN PRESSURE SENSOR DEVICE Public/Granted day:2015-10-08
Information query
