Invention Grant
- Patent Title: Machining simulation device and method
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Application No.: US14123653Application Date: 2012-06-20
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Publication No.: US09639656B2Publication Date: 2017-05-02
- Inventor: Akira Miyata
- Applicant: Akira Miyata
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-144680 20110629
- International Application: PCT/JP2012/065757 WO 20120620
- International Announcement: WO2013/002097 WO 20130103
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G05B19/4069

Abstract:
A machining simulation device includes a local-region setting unit that sets a local region for a workpiece, an offset-deformation processing unit that offsets and deforms a shape of a part of a whole three-dimensional shape model of the workpiece, for which the local region is set, and generates a local three-dimensional shape model of the workpiece, a local tool-movement-data output unit that outputs local tool movement data from whole tool movement data based on a tool model and movement path data of a tool, a local cutting-deformation processing unit that cuts and deforms the local three-dimensional shape model of a workpiece based on the local tool movement data, and a display superimposing unit that superimposes the cut and deformed local three-dimensional shape model of the workpiece on the whole three-dimensional shape model of the workpiece, and displays the superimposed result.
Public/Granted literature
- US20140114458A1 MACHINING SIMULATION DEVICE AND METHOD Public/Granted day:2014-04-24
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