Invention Grant
- Patent Title: Crosslinked resin compound and wire and cable using the same
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Application No.: US14140023Application Date: 2013-12-24
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Publication No.: US09640299B2Publication Date: 2017-05-02
- Inventor: Keisuke Sugita , Akinari Nakayama
- Applicant: Hitachi Metals, Ltd.
- Applicant Address: JP Tokyo
- Assignee: HITACHI METALS, LTD.
- Current Assignee: HITACHI METALS, LTD.
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC.
- Priority: JP2012-284790 20121227; JP2013-263135 20131220
- Main IPC: H01B3/44
- IPC: H01B3/44 ; C09D123/08 ; C08L23/08 ; C08K5/00 ; C08K5/523
Abstract:
A crosslinked resin compound includes a resin compound including 0.1 to 20 parts by mass of one material selected from the group consisting of monomer having an epoxy group, acid anhydride and silane coupling agent with respect to 100 parts by mass of ethylene-based copolymer, and the resin compound is crosslinked.
Public/Granted literature
- US20140182883A1 CROSSLINKED RESIN COMPOUND AND WIRE AND CABLE USING THE SAME Public/Granted day:2014-07-03
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