Invention Grant
- Patent Title: Cable with molded resin
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Application No.: US14732532Application Date: 2015-06-05
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Publication No.: US09640302B2Publication Date: 2017-05-02
- Inventor: Kazuhisa Takahashi , Masanori Sagawa , Yukio Ikeda , Takahiro Futatsumori
- Applicant: Hitachi Metals, Ltd.
- Applicant Address: JP Tokyo
- Assignee: HITACHI METALS, LTD.
- Current Assignee: HITACHI METALS, LTD.
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC.
- Priority: JP2014-124649 20140617
- Main IPC: H01B7/24
- IPC: H01B7/24 ; G01D11/24 ; H01R13/58 ; H01B3/30 ; H01B3/42 ; H01B3/47

Abstract:
A cable with a molded resin includes a cable including an electric wire and a sheath covering the electric wire, the electric wire including a central conductor and an insulation covering the central conductor, and a molded resin covering a part of the electric wire protruding from the sheath in a longitudinal direction thereof, the molded resin being apart from the sheath. The electric wire is bent at not less than one bent part in the molded resin.
Public/Granted literature
- US20150364231A1 CABLE WITH MOLDED RESIN Public/Granted day:2015-12-17
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