A ceramic electronic component with metal terminals comprising a chip component of approximately parallelepiped shape having a pair of terminal electrodes, and a pair of metal terminal parts provided in accordance with the terminal electrodes. The terminal electrode is formed by wrapping around a part of side faces from an end face of the chip component. The metal terminal part comprises a connecting part connecting to the terminal electrode and including a connecting face extending approximately parallel to the end face, plurality of joint parts connecting to the connecting part and including a joint face extending in a different direction of the connecting face, and plurality of mounting parts connecting to the joint parts and including a mounting part upper face extending approximately parallel to any one of the side faces which is different direction of the joint face by taking predetermined spaces.