Invention Grant
- Patent Title: System comprising electronics housing and grounding contact assembly
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Application No.: US15104272Application Date: 2014-12-09
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Publication No.: US09640342B2Publication Date: 2017-05-02
- Inventor: Oliver Knoerrchen , Stephan Stanke , Ulrike Radermacher
- Applicant: EATON ELECTRICAL IP GMBH & CO. KG
- Applicant Address: DE Schoenefeld
- Assignee: EATON ELECTRICAL IP GMBH & CO. KG
- Current Assignee: EATON ELECTRICAL IP GMBH & CO. KG
- Current Assignee Address: DE Schoenefeld
- Agency: Leydig, Voit & Mayer, Ltd
- Priority: DE102013114261 20131217
- International Application: PCT/EP2014/077009 WO 20141209
- International Announcement: WO2015/091098 WO 20150625
- Main IPC: H01H9/02
- IPC: H01H9/02 ; H01R4/48 ; H01R4/64 ; H01R9/26 ; H02B1/052 ; H01R12/71 ; H01R13/17 ; H01R13/26 ; H01R13/426 ; H01R13/652

Abstract:
A system has an electronics housing and a grounding contact assembly for electromechanical switchgear that can be mounted on a mounting rail, wherein the grounding contact assembly can be mounted in the electronics housing. The base region of the electronics housing faces a mounting rail, is provided with an externally accessible mounting duct for a grounding contact that can be mounted in the duct, and contacts the mounting rail in a spring-leaded manner. The contact part has a blade contact at one end and at the other end a terminal receiving part which is angled perpendicularly to the first free end of the blade contact and is designed as a detent pin. The grounding contact assembly can be pushed into the mounting duct irrespective of the position of the electronics housing on the mounting rail.
Public/Granted literature
- US20160314911A1 SYSTEM COMPRISING ELECTRONICS HOUSING AND GROUNDING CONTACT ASSEMBLY Public/Granted day:2016-10-27
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