Invention Grant
- Patent Title: Substrate cleaning apparatus and substrate cleaning method
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Application No.: US14139746Application Date: 2013-12-23
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Publication No.: US09640384B2Publication Date: 2017-05-02
- Inventor: Tomoatsu Ishibashi
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Baker & Hostetler LLP
- Priority: JP2012-287120 20121228
- Main IPC: B08B3/04
- IPC: B08B3/04 ; H01L21/02 ; H01L21/67

Abstract:
A substrate cleaning apparatus includes: a substrate holder configured to hold and rotate a substrate; an ultrasonic cleaning unit configured to impart an ultrasonic vibration energy to deaerated pure water and then supply the deaerated pure water onto a surface of the substrate; a pure water spray nozzle configured to spray deaerated pure water onto the surface of the substrate; a chamber surrounding the substrate holder and the pure water spray nozzle; and an inert gas supply line configured to supply an inert gas into the chamber.
Public/Granted literature
- US20140182628A1 SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD Public/Granted day:2014-07-03
Information query
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