Invention Grant
- Patent Title: Grounded die seal integrated circuit structure for RF circuits
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Application No.: US15135190Application Date: 2016-04-21
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Publication No.: US09640494B1Publication Date: 2017-05-02
- Inventor: Vikas Sharma
- Applicant: Peregrine Semiconductor Corporation
- Applicant Address: US CA San Diego
- Assignee: Peregrine Semiconductor Corporation
- Current Assignee: Peregrine Semiconductor Corporation
- Current Assignee Address: US CA San Diego
- Agency: Jaquez Land Greenhaus LLP
- Agent Martin J. Jaquez, Esq.; John Land, Esq.
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/66 ; H01L23/58 ; H01L23/62 ; H01L27/12 ; H01L23/528 ; H01L21/768 ; H01L21/84
Abstract:
An integrated circuit (IC) structure for radio frequency circuits having a grounded die seal that mitigates the effects of parasitic coupling through the die seal. Embodiments include conductive grounding ties that each electrically couple one or more of the internal grounding pads on an IC die within the magnetic loop formed by the die seal ring to an adjacent extent of an IC die seal. Induced parasitic energy within the die seal ring is quickly coupled to ground through the corresponding grounding ties and grounding pads. Accordingly, very little, if any, induced parasitic energy is propagated around the die seal ring.
Information query
IPC分类:
