A stacked electronic package includes a substrate and conductive straps each having sides, a top, and a bottom opposite the top. Each conductive strap is coupled along the bottom to an upper surface of the substrate and is separate from others of the conductive straps. A length of at least one of the sides is greater than a width of at least another one of the sides. An encapsulant extends over the upper surface and side surfaces of the substrate and the sides of the conductive straps. A passive electronic component is disposed over the conductive straps, and each conductive strap is coupled along the top to a terminal of the passive electronic component.