Invention Grant
- Patent Title: Integrated circuit with hydrogen absorption structure
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Application No.: US14695426Application Date: 2015-04-24
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Publication No.: US09640544B2Publication Date: 2017-05-02
- Inventor: Arata Okuyama , Ryo Urakawa , Hiroshi Omi
- Applicant: SanDisk Technologies, Inc.
- Applicant Address: US TX Plano
- Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee Address: US TX Plano
- Agency: Foley & Lardner LLP
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L27/105 ; H01L27/11524 ; H01L27/11529 ; H01L23/26 ; H01L21/768

Abstract:
An integrated circuit such as a NAND flash memory includes a dielectric layer overlying transistors (e.g. NAND flash memory cells) that are formed along a surface of a substrate and a hydrogen absorption structure overlying the dielectric layer, the hydrogen absorption structure extending over the transistors, the hydrogen absorption structure being electrically isolated from the transistors.
Public/Granted literature
- US20160315091A1 INTEGRATED CIRCUIT WITH HYDROGEN ABSORPTION STRUCTURE Public/Granted day:2016-10-27
Information query
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