Invention Grant
- Patent Title: Semiconductor device, layout design and method for manufacturing a semiconductor device
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Application No.: US14693927Application Date: 2015-04-23
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Publication No.: US09640605B2Publication Date: 2017-05-02
- Inventor: Wei-Yu Ma , Chia-Hui Chen , Yi-Ting Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: H01L27/11
- IPC: H01L27/11 ; H01L49/02 ; H01L27/06 ; H01L29/93 ; H01L27/02

Abstract:
A semiconductor device includes a first semiconductor structure having a first active region pattern density. The semiconductor device further includes a second semiconductor structure having a second active region pattern density, wherein the second semiconductor structure comprises a first resistive element. The semiconductor device further includes a third semiconductor structure having a third active region pattern density, wherein the third semiconductor structure includes a second resistive element. The second semiconductor structure is adjacent to the first semiconductor structure and adjacent to the third semiconductor structure. The first semiconductor structure, the second semiconductor structure and the third semiconductor structure do not overlap.
Public/Granted literature
- US20160293689A1 SEMICONDUCTOR DEVICE, LAYOUT DESIGN AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE Public/Granted day:2016-10-06
Information query
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