Invention Grant
- Patent Title: Integrated circuit device, system, and method of fabrication
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Application No.: US13561597Application Date: 2012-07-30
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Publication No.: US09640653B2Publication Date: 2017-05-02
- Inventor: Wojciech P. Maly
- Applicant: Wojciech P. Maly
- Applicant Address: US PA Pittsburgh
- Assignee: Carnegie Mellon University
- Current Assignee: Carnegie Mellon University
- Current Assignee Address: US PA Pittsburgh
- Agency: Fox Rothschild LLP
- Agent Dennis M. Carleton
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L27/12 ; H01L29/06 ; H01L29/788
Abstract:
A semiconductor device, comprising a first semiconductor portion having a first end, a second end, and a slit portion, wherein the width of the slit portion is less than the width of at least one of the first end and the second end; a second portion that is a different material than the first semiconductor portion, a third portion that is a different material than the first semiconductor portion, wherein the second and third portions are on opposite sides of the slit portion, and at least three terminals selected from a group consisting of a first terminal connected to the first end, a second terminal connected to the second end, a third terminal connected to the second portion, and a fourth terminal connected to the third portion.
Public/Granted literature
- US20130154010A1 Integrated Circuit Device, System, and Method of Fabrication Public/Granted day:2013-06-20
Information query
IPC分类:
