A receptacle assembly is disclosed having a plurality of contact pins, a contact aligning block, a block receiving body, a housing, and a retaining plate. The contact aligning block is formed to retain the contact pins, and into which a portion of the contact pins is inserted. The block receiving body is overmolded to cover the contact aligning block. The block receiving body is positioned in the housing. The retaining plate is positioned against the block receiving body, applying a force against the block receiving body, and compressively holding and retaining the block receiving body in the housing.